System in a Package

The Internet of Things if putting complex electronic systems into products we interact with throughout the day. While conventional surface mount area array components are routinely 100% inspected with Printed Circuit Board Assembly (PCBA) AXI, these tools lack the resolution and sensitivity to inspect the smaller feature size conductors in SiP.

SVXR’s X200 HR-AXI technology allows high speed 100% inspection and metrology in the micron scale. With high sensitivity and machine learning based inspection algorithms, the X200 automatically inspects SiP product to rapidly detect process variation and screen defects such as non-wet solder joints, bridging, and voids.

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