Advanced Packaging

Advancements in semiconductor packaging continue to enable higher performance in electronic components. With advanced packaging comes tighter tolerances, smaller interconnect, and more vertical layers. Together with increasingly stringent quality and reliability requirements from system manufacturers, these trends have exposed the limitations of existing inspection and metrology techniques.

SVXR’s 2.5D Power CT technology was developed from the ground up to quickly and precisely identify small changes in device interconnect structure and provide real time feedback for process control and screening.

Instead of pulling a small sample from your manufacturing line for lengthy and data limited 3D X-ray and cross sectioning, automatically monitor 100% of your production in real time and achieve new levels of quality, reliability, and production yield with HR-AXI from SVXR.

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Metrology for High Density Solder Interconnect