2.5/3D IC

Artificial intelligence, high speed networking, and other processing intensive devises are moving to 2.5 and 3D package structures to achieve high memory bandwidth and line data rates. Vertical integration compels manufacturers to use transmissive techniques to monitor their processes however conventional point projection high resolution X-ray lacks speed and sensitivity to provide adequate line control.

SVXR’s 2.5D Power CT technology acquires massive data sets in seconds with full resolution across the full field of view. Using advanced machine learning algorithms, thousands of solder joints are immediately characterized and evaluated. Detailed heat maps and outlier detection informs manufacturing process control and screens out defective product.